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  ?2008 fairchild semiconductor corporation 1 www.fairchildsemi.com FGB20N60SFD rev. a FGB20N60SFD 600v, 20a field stop igbt october 2010 absolute maximum ratings symbol description ratings units v ces collector to emitter voltage 600 v v ges gate to emitter voltage 20 v i c collector current @ t c = 25 o c 40 a collector current @ t c = 100 o c 20 a i cm (1) pulsed collector current @ t c = 25 o c 60 a i f diode forward current @ t c = 25 o c 20 a diode forward current @ t c = 100 o c 10 a i fm(1) pulsed diode maximum forward current 60 a p d maximum power dissipation @ t c = 25 o c 208 w maximum power dissipation @ t c = 100 o c 83 w t j operating junction temperature -55 to +150 o c t stg storage temperature range -55 to +150 o c t l maximum lead temp. for soldering purposes, 1/8? from case for 5 seconds 300 o c notes: 1: repetitive rating: pulse width limited by max. junction temperature FGB20N60SFD 600v, 20a field stop igbt g c e eg collector (flange) to-263ab/d 2 -pak c features ? high current capability ? low saturation voltage: v ce(sat) =2.2v @ i c = 20a ? high input impedance ? fast switching ?rohs compliant applications ? welder, ups, smps, pfc general description using novel field stop igbt tech nology, fairchild?s new series of field stop igbts offer the optimum performance for welder, ups, smps and pfc applications where low conduction and switching losses are essential.
2 www.fairchildsemi.com FGB20N60SFD rev. a FGB20N60SFD 600v, 20a field stop igbt thermal characteristics symbol parameter typ. max. units r jc (igbt) thermal resistance, junction to case - 0.6 o c /w r jc (diode) thermal resistance, junction to case - 2.6 o c /w r ja thermal resistance, junction to ambient (pcb mount)(2) - 40 o c /w notes: 2: mounted on 1? square pcb (fr4 or g-10 material) package marking and ordering information device marking device package rel size tape width quantity FGB20N60SFD FGB20N60SFD to-263ab/d2-pak 13? dia - 800 electrical characteristi cs of the igbt t c = 25c unless otherwise noted symbol parameter test conditions min. typ. max. units off characteristics bv ces collector to emitter breakdown voltage v ge = 0v, i c = 250 a 600 - - v bv ces t j temperature coefficient of breakdown voltage v ge = 0v, i c = 250 a - 0.6 - v/ o c i ces collector cut-off current v ce = v ces , v ge = 0v - - 250 a i ges g-e leakage current v ge = v ges , v ce = 0v - - 400 na on characteristics v ge(th) g-e threshold voltage i c = 250 a, v ce = v ge 4.0 5.0 6.5 v v ce(sat) collector to emitter saturation voltage i c = 20a , v ge = 15v - 2. 2 2.8 v i c = 20a , v ge = 15v, t c = 1 25 o c - 2. 4 - v dynamic characteristics c ies input capacitance v ce = 30v , v ge = 0v, f = 1mhz - 940 - pf c oes output capacitance - 110 - pf c res reverse transfer capacitance - 40 - pf switching characteristics t d(on) turn-on delay time v cc = 400v, i c = 20a, r g = 10 , v ge = 15v, inductive load, t c = 25 o c - 13 - ns t r rise time - 16 - ns t d(off) turn-off delay time - 90 - ns t f fall time - 24 48 ns e on turn-on switching loss - 0.37 - mj e off turn-off switching loss - 0.16 - mj e ts total switching loss - 0.53 - mj t d(on) turn-on delay time v cc = 400v, i c = 20a, r g = 10 , v ge = 15v, inductive load, t c = 125 o c - 12 - ns t r rise time - 16 - ns t d(off) turn-off delay time - 95 - ns t f fall time - 28 - ns e on turn-on switching loss - 0.4 - mj e off turn-off switching loss - 0.28 - mj e ts total switching loss - 0.69 - mj
q g total gate charge v ce = 400v, i c = 20a, v ge = 15v - 65 - nc q ge gate to emitter charge - 7 - nc q gc gate to collector charge - 33 - nc 3 www.fairchildsemi.com FGB20N60SFD rev. a FGB20N60SFD 600v, 20a field stop igbt electrical characteristi cs of the igbt t c = 25c unless otherwise noted electrical characteristi cs of the diode t c = 25c unless otherwise noted symbol parameter test conditions min. typ. max units v fm diode forward voltage i f = 10a t c = 25 o c - 1.9 2.5 v t c = 125 o c - 1.7 - t rr diode reverse recovery time i f =10a, di f /dt = 200a/ s t c = 25 o c - 34 - ns t c = 125 o c - 57 - q rr diode reverse recovery charge t c = 25 o c - 41 - nc t c = 125 o c - 96 -
4 www.fairchildsemi.com FGB20N60SFD rev. a FGB20N60SFD 600v, 20a field stop igbt typical performance characteristics figure 1. typical output characteristics figure 2. typical output char acteristics figure 3. typical saturation voltage figure 4. transfer characteristics characteristics figure 5. saturation voltage vs. case figure 6. saturation voltage vs. v ge temp erature at variant current level 0.01.53.04.56.0 0 20 40 60 20v t c = 25 o c 15v 12v 10v v ge = 8v collector current, i c [a] collector-emitter voltage, v ce [v] 0.01.53.04.56.0 0 20 40 60 20v t c = 125 o c 15v 12v 10v v ge = 8v collector current, i c [a] collector-emitter voltage, v ce [v] 012345 0 20 40 60 common emitter v ge = 15v t c = 25 o c t c = 125 o c collector current, i c [a] collector-emitter voltage, v ce [v] 4681012 0 20 40 60 common emitter v ce = 20v t c = 25 o c t c = 125 o c collector current, i c [a] gate-emitter voltage,v ge [v] 25 50 75 100 125 1 2 3 4 40a 20a i c = 10a common emitter v ge = 15v collector-emitter voltage, v ce [v] collector-emitter case temperature, t c [ o c] 0 4 8 121620 0 4 8 12 16 20 i c = 10a 20a 40a common emitter t c = -40 o c collector-emitter voltage , v ce [v] gate-emitter voltage, v ge [v]
5 www.fairchildsemi.com FGB20N60SFD rev. a FGB20N60SFD 600v, 20a field stop igbt typical performance characteristics figure 7. saturation voltage vs. v ge figure 8. saturation voltage vs. v ge figure 9. capacitance characteristics figure 10. gate charge characteristics figure 11. soa characteristics figure 12. turn-on characteristics vs. gate resistance 0 4 8 121620 0 4 8 12 16 20 i c = 10a 20a 40a common emitter t c = 25 o c collector-emitter voltage , v ce [v] gate-emitter voltage, v ge [v] 0 4 8 121620 0 4 8 12 16 20 40a i c = 10a 2 0a common emitter t c = 125 o c collector-emitter voltage, v ce [v] gate-emitter voltage, v ge [v] 0.1 1 10 0 500 1000 1500 2000 2500 common emitter v ge = 0v, f = 1mhz t c = 25 o c c res c oes c ies capacitance [pf] collector-emitter voltage, v ce [v] 30 020406080 0 3 6 9 12 15 common emitter t c = 25 o c 300v 200v v cc = 100v gate-emitter voltage, v ge [v] gate charge, q g [nc] 0 102030405060 5 10 100 common emitter v cc = 400v, v ge = 15v i c = 20a t c = 25 o c t c = 125 o c t d(on) t r switching time [ns] gate resistance, r g [ : ] 1 10 100 1000 0.1 1 10 100 1ms 10 ms dc *notes: 1. t c = 25 o c 2. t j = 150 o c 3. single pulse 10 p s 100 p s collector current, i c [a] collector-emitter voltage, v ce [v]
6 www.fairchildsemi.com FGB20N60SFD rev. a FGB20N60SFD 600v, 20a field stop igbt typical performance characteristics figure 13. turn-off characteristics vs. figure 14. turn-on characteristics vs. gate resistance collector current figure 15. turn-off characteristics vs. figure 16. switching loss vs. collector current gate resistance figure 17. switching loss vs. figure 18. turn off switching collector current soa characteristics 0 102030405060 10 100 1000 common emitter v cc = 400v, v ge = 15v i c = 20a t c = 25 o c t c = 125 o c t d(off) t f switching time [ns] gate resistance, r g [ : ] 0 10203040 3 10 100 200 common emitter v ge = 15v, r g = 10 : t c = 25 o c t c = 125 o c t r t d(on) switching time [ns] collector current, i c [a] 0 10203040 10 100 300 common emitter v ge = 15v, r g = 10 : t c = 25 o c t c = 125 o c t d(off) t f switching time [ns] collector current, i c [a] 0 102030405060 0.1 1 3 common emitter v cc = 400v, v ge = 15v i c = 20a t c = 25 o c t c = 125 o c e on e off switching loss [mj] gate resistance, r g [ : ] 1 10 100 1000 1 10 80 safe operating area v ge = 15v, t c = 125 o c collector current, i c [a] collector-emitter voltage, v ce [v] 010203040 0.02 0.1 1 10 common emitter v ge = 15v, r g = 10 : t c = 25 o c t c = 125 o c e on e off switching loss [mj] collector current, i c [a]
7 www.fairchildsemi.com FGB20N60SFD rev. a FGB20N60SFD 600v, 20a field stop igbt typical performance characteristics figure 19. forward characteristics figure 20. reverse current figure 21. stored charge figure 22. reverse recovery time figure 23.transient thermal impedance of igbt 0 100 200 300 400 500 600 1e-3 0.01 0.1 1 10 100 t c = 125 o c t c = 25 o c t c = 75 o c reverse current , i r [ p a] reverse voltage, v r [v] 01234 0.1 1 10 40 t j = 75 o c t j = 25 o c t j = 125 o c forward voltage, v f [v] forward current, i f [a] 0 5 10 15 20 10 20 30 40 50 60 200a/ p s di/dt = 100a/ p s stored recovery charge, q rr [nc] forward current, i f [a] 0 5 10 15 20 10 20 30 40 50 60 200a/ p s di/dt = 100a/ p s reverse recovery time, t rr [ns] forward current, i f [a] 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 0.01 0.1 1 0.01 0.02 0.1 0.05 0.2 single pulse thermal response [zthjc] rectangular pulse duration [sec] duty factor, d = t1/t2 peak t j = pdm x zthjc + t c 0.5 t 1 p dm t 2
8 www.fairchildsemi.com FGB20N60SFD rev. a FGB20N60SFD 600v, 20a field stop igbt mechanical dimensions to-263ab/d 2 -pak
FGB20N60SFD 600v, 20 a field stop igbt FGB20N60SFD rev. a www.fairchildsemi.com 9 trademarks the following includes registered and unregistered trademarks and service marks, owned by fairchild semiconductor and/or its gl obal subsidiaries, and is not intended to be an exhaustive list of all such trademarks. *trademarks of system general corporation, used under license by fairchild semiconductor. disclaimer fairchild semiconductor reserves the right to make changes with out further notice to any products herein to improve reliability, function, or design. fairchild does not assume an y liability arising out of th e application or use of any product or circuit described herein; neither does it convey an y license under its patent rights, nor the rights of others. these specifications do not expand the term s of fairchild?s worldwide terms and conditions, specifically the warranty therein, which covers these products. life support policy fairchild?s products are not authorized fo r use as critical components in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used here in: 1. life support devices or systems ar e devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. a critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. product status definitions definition of terms accupower? auto-spm? build it now? coreplus? corepower? crossvolt ? ctl? current transfer logic? deuxpeed ? dual cool? ecospark ? efficentmax? esbc? fairchild ? fairchild semiconductor ? fact quiet series? fact ? fast ? fastvcore? fetbench? flashwriter ? * fps? f-pfs? frfet ? global power resource sm green fps? green fps? e-series? g max ? gto? intellimax? isoplanar? megabuck? microcoupler? microfet? micropak? micropak2? millerdrive? motionmax? motion-spm? optihit? optologic ? optoplanar ? ? pdp spm? power-spm? powertrench ? powerxs? programmable active droop? qfet ? qs? quiet series? rapidconfigure? saving our world, 1mw/w/kw at a time? signalwise? smartmax? smart start? spm ? stealth? superfet? supersot?-3 supersot?-6 supersot?-8 supremos? syncfet? sync-lock? ?* the power franchise ? ? tinyboost? tinybuck? tinycalc? tinylogic ? tinyopto? tinypower? tinypwm? tinywire? trifault detect? truecurrent?* p serdes? uhc ? ultra frfet? unifet? vcx? visualmax? xs? ? datasheet identification product status definition advance information formative / in design datasheet contains the design specifications for product development. specifications may change in any manner without notice. preliminary first production datasheet contains preliminary data; supplementary data will be published at a later date. fairchild semiconductor reserves the right to make changes at any time without notice to improve design. no identification needed full production datasheet contains final specifications. fa irchild semiconductor reserves the right to make changes at any time without notice to improve the design. obsolete not in production datasheet contains specifications on a product that is discontinue d by fairchild semiconductor. the datasheet is for reference information only. anti-counterfeiting policy fairchild semiconductor corporation?s anti-counterfeiting policy. fairchild?s anti-counterfeiting policy is also stated on our external website, www.fairchildsemi.com, under sales support . counterfeiting of semiconductor parts is a growing problem in th e industry. all manufactures of semiconductor products are expe riencing counterfeiting of their parts. customers who inadvertently purchase counterfeit parts ex perience many problems such as loss of brand reputation, substa ndard performance, failed application, and increased cost of production and manufacturing dela ys. fairchild is taking strong measures to protect ourselve s and our customers from the proliferation of counterfeit parts. fairchild strongly encourages customers to purchase fairchild parts either directly from fa irchild or from authorized fairchild distributors who are listed by co untry on our web page cited above. products customers buy either from fairchild directly or fr om authorized fairchild distributors are genuine parts, have full traceability, meet fairchild?s quality standards for handing and storage and provide access to fairchild?s full range of up-to-date technical and product information. fairchild and ou r authorized distributors will stand behind all warranties and wi ll appropriately address and warranty issues that may arise. fairchild will not provide any warranty coverage or other assistance for parts bought from unau thorized sources. fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. rev. i48 ?


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